Read the latest press releases about new technological developments, product announcements and pmd-partnerships to be up to date in the world of Time-of-Flight depth-sensing technology.
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The new VGA 3D imager is the highest resolution, most flexible and robust depth sensor that has ever been developed by pmd and Infineon.
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Infineon has collaborated with software and 3D Time of Flight specialist pmdtechnologies to develop the world’s smallest and at the same time most powerful 3D image sensor.
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Smartphone cameras increasingly require 3D vision capabilities as differentiating factor.
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The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements of the mobile consumer device market and, in particular, demand for higher resolutions with small lenses.
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For the first time, a smartphone with a dedicated user-facing time-of-flight (ToF) camera is entering the mass market.
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The revolutionary AI camera is now generally available.
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We are very proud to present together with our partner Infineon the world's smallest 3D ToF module.